Reflow oven

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Tools

Picture of Reflow oven in the fablab

Model LKPF Protoflow
Room IoT Innovation Lab
Work envelope/max capacity
Link to manual https://archive.org/details/manualzilla-id-5907642/page/2/mode/2up
Related tools
Trainer(s)
Training Sessions no training sessions include this tool
Knowledge keeper(s) Dave Ostapchuk
Training document(s)
Material Safety Data Sheet (MSDS)
Safe Work Procedure
Consumables
Software this machine has no software listed
Equipment type tool
IoT Innovation Lab Precautions apply   

You will be working in the IoT Innovation Lab . In order to keep safe from hazards created by you or other workers using any of the tools in this room, the following precautions apply in addition to any other precautions:

WORK IN PROGRESS

  • Tools and consumables in this room contain toxic chemicals, lead, and are a fire risk.
  • Equipment in this room can carry dangerously high voltage and current.
  • NO EATING OR DRINKING IN THE IoT INNOVATION LAB. Safety committee swabbed surfaces for lead and found that there was a lot of residual lead on the workbenches, and you don't want to risk ingesting it.
  • When working with any liquids or emulsions (including water, flux, cleaning products, solder paste, etc,) ensure you have paper towels nearby to contain and clean up a spill.
  • When working with any hazardous chemicals or substances (eg. solder paste, flux, cleaning products, etchant, etc) you must wear nitrile gloves and eye protection.
  • Keep flammables, such as isopropyl alcohol, away from sources of heat, such as soldering irons, hot air guns, and PCB preheaters
  • There is a lead solder disposal bucket available for disposing of lead solder

LEAD/CHEMICAL/FIRE RISK

This is used for soldering/reflowing a PCB that has surface-mount components.

The PCB requires an application of solder paste and placement of components before placing in the oven. Solder paste is not provided by North Forge, the recommended type and grade for most applications is no-clean thermally stable T3 (T4+ for smaller components/pin pitch).

Double-sided boards are possible in this unit depending on the mass of the components used, size of pad, and amount of solder paste.

If your board has large SMT components (eg. 1206/0805 or SOIC) you can easily apply solder paste by hand to the pads. For smaller components, using a solder paste stencil with the SD-360U_SMT_stencil_printer will make things much easier.